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iimveliso

Iimveliso

I-Triethoxyoctylsilane CAS:2943-75-1

I-Triethoxyoctylsilane yiarhente yokudibanisa i-silane enefomyula yekhemikhali i-C16H36O3Si, equlathe iqela le-octyl kunye namaqela amathathu e-ethoxy aqhotyoshelwe kwi-atom ye-silicon. Lulwelo olungenambala olusebenza njengohlengahlengiso lomphezulu kunye nokukhuthaza ukunamathela kwizicelo ezahlukeneyo zezinto, olubonelela ngokuhambelana okuphuculweyo kunye namandla okubopha phakathi kwezinto eziphilayo kunye nezinto ezingaphiliyo.


Iinkcukacha zeMveliso

Iithegi zeMveliso

Ukusetyenziswa kunye nesiphumo:

I-Triethoxyoctylsilane isetyenziswa kakhulu njengearhente yokudibanisa kwiindlela zokunyanga umphezulu, ii-coating, i-adhesives, kunye nezinto ezidityanisiweyo. Ukusebenza kwayo kuyenza ikwazi ukudibana neendawo ezidityanisiweyo nezingenamanzi, iphucule amandla okunamathela, ukumelana nokufuma, kunye nokuqina kweekhemikhali kwiindlela ezahlukeneyo zokusebenza kwezoshishino. Kwicandelo lee-polymer composites, i-Triethoxyoctylsilane isetyenziswa njenge-compatibilizer ukuphucula ukusasazeka kunye nokunamathelana phakathi kwezizalisi, ezifana neefayibha zeglasi, ii-carbon nanotubes, kunye nee-nanoparticles, ngaphakathi kwee-polymer matrices. Ngokukhuthaza ukusebenzisana okungcono kwe-filler-matrix, inegalelo ekuphuculeni iipropati zoomatshini, ukuzinza kobushushu, kunye nokumelana nempembelelo kwizinto ezidityanisiweyo ezisetyenziswa kwiimoto, kwi-aerospace, nakwi-structural engineering. Ngaphezu koko, i-Triethoxyoctylsilane isetyenziswa ekuqulunqweni kwee-sealants kunye nee-coating zezixhobo zokwakha, ezifana nekhonkrithi, i-masonry, kunye ne-stone surfaces. Amandla ayo okwenza i-bond ehlala ixesha elide kunye ne-mineral substrates andisa ukumelana nemozulu, ukuchasana namanzi, kunye nobude be-coating yokukhusela, enegalelo ekugcinweni nasekugcinweni kwezakhiwo zokwakha kwiimeko ezinzima zendalo. Kwishishini le-elektroniki, i-Triethoxyoctylsilane isetyenziswa njengesilungisi somphezulu kunye nesikhuthazi sokunamathela kwi-microelectronic packaging kunye ne-semiconductor device assemblies. Inceda ukubopha ii-silicones, ii-epoxies, kunye nezinye ii-polymers kwiindawo ze-semiconductor, ibonelela nge-encapsulation ethembekileyo, ukhuseleko lokufuma, kunye nokufakelwa kombane kwiisekethe ezidibeneyo kunye nezixhobo ze-elektroniki. Ukongeza, i-Triethoxyoctylsilane idlala indima ekuguqulweni komphezulu kweefilimu zeplastiki, iindawo zesinyithi, kunye neempahla ukuze zinike iipropati ze-hydrophobic, anti-fouling, okanye anti-corrosive. Ngokwenza ii-monolayers ezizihlanganisele zona kwiindawo, iphucula iimpawu zazo zokusebenza, izenze zilungele ukusetyenziswa kwi-packaging, kwi-marine coating, nakwi-textile finishes ezifuna ukugxothwa kwamanzi kunye ne-oyile. Ngokubanzi, i-Triethoxyoctylsilane ibonisa ukuguquguquka nokusebenza njenge-arhente yokudibanisa kunye nesilungisi somphezulu ngezicelo ezahlukeneyo kwisayensi yezinto, ukuvelisa izinto ezidibeneyo, ukwakha, ukupakisha ii-elektroniki, kunye nokukhusela umphezulu, ibonisa ukubaluleka kwayo ekuphuculeni ukusebenza kunye nokusebenza kweemveliso ezahlukeneyo kumashishini ahlukeneyo.

Isampulu yeMveliso:

I-L-Arginine1
I-L-Arginine2

Ukupakisha imveliso:

I-L-Arginin3

Iinkcukacha ezongezelelweyo:

Ukwakhiwa C16H36O3Si
Uvavanyo 99%
Inkangeleko umgubo omhlophe
Inombolo ye-CAS 2943-75-1
Ukupakisha Encinci kwaye ininzi
Beka ubomi kwishelufa iminyaka eyi-2
Indawo yokugcina izinto Gcina kwindawo epholileyo neyomileyo
Isiqinisekiso I-ISO.

 


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